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PCB Manufacture
Half-holeModulePCB
Material：FR-4 ；Layer：4L；FinishBoardThickness：1.2mm;MinLineWidth/Space：4/3mil；MinHoleSize：0.15mm; SurfaceFinish：ENIG
SecurityPCB
Material：FR-4 ；Layer：4L；FinishBoardThickness：1.2mm;MinLineWidth/Space：4/3mil；MinHoleSize：0.15mm; SurfaceFinish：ENIG
Power control board
Material: FR‑4; Layers: 4L; Finished board thickness: 1.6mm; Trace width / trace spacing: 6/5mil; Minimum hole size: 0.2mm; Surface finish: OSP
Industrial control board
Material: FR‑4; Layers: 4L; Finished board thickness: 2.0mm; Trace width / trace spacing: 6/8mil; Minimum hole size: 0.3mm; Surface finish: Immersion Tin
Ceramic PCB
Material：Ceramic substrate；Layer：1L；FinishBoardThickness：2.4mm;MinLineWidth/Space：10/8mil；MinHoleSize：0.6mm; SurfaceFinish：ENIG
PCB Cloning
Expert reverse engineering services to convert physical PCB samples into complete CAD files, Schematics, and BOM lists with guaranteed 100% precision.
Rigid PCB
Leading-edge rigid PCB manufacturing services from single-sided to complex 56-layer multilayer boards with industry-leading precision.
Ceramic PCB
Superior thermal management with Alumina (Al2O3) and Aluminum Nitride (AlN) substrates for high-power, high-frequency, and aerospace applications.
Flexible PCB
High-quality flexible and rigid-flex PCBs engineered for dynamic applications where space, weight and movement matter.
Rigid-Flex PCB
Seamlessly integrating flexible and rigid substrates to eliminate connectors, reduce weight, and maximize space in high-performance electronics.
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