Half-hole
ModulePCB

Material:FR-4 ;Layer:4L;

FinishBoardThickness:1.2mm;

MinLineWidth/Space:4/3mil;

MinHoleSize:0.15mm; SurfaceFinish:ENIG

download
● IPC-A-600Acceptability of Printed Boards
● IPC-6012Rigid Board Performance
● ISO 9001Quality Management
● IATF 16949Automotive Standard
● UL 94V-0Flammability Rating
● ISO 14001Environmental Management
● IPC-A-600 Acceptability of Printed Boards
● IPC-A-600 Acceptability of Printed Boards
● IPC-A-600 Acceptability of Printed Boards
● IPC-A-600 Acceptability of Printed Boards
● IPC-A-600 Acceptability of Printed Boards
● IPC-A-600 Acceptability of Printed Boards
PCB Manufacture

Types

PCB Manufacture

Technical Specifications

PCB Manufacture

Materials

Property

PIPolyimide

PETPolyester

PENPolyethylene Naphthalate

LCPLiquid    Crystal Polymer

Temp Range

−65°C to 260°C

−40°C to 105°C

−50°C to 155°C

−200°C to 240°C

Dielectric Constant

3.4 – 3.5

3.3

3.2

2.9 – 3.2

Moisture Absorption

2.5 – 3.0%

0.4%

0.3%

<0.04%

Tensile Strength

180 MPa

180 MPa

220 MPa

200 MPa

Flex Endurance





RF Performance





Cost Level





Best For

Standard flex circuits, aerospace

Consumer electronics, disposables

Automotive, industrial

RF, microwave, 5G antenna


● Green = performance level · Amber = relative cost (more dots = higher cost) · LCP column highlighted as premium RF substrate
PCB Manufacture

Manufacturing Process

Material Preparation
Material Preparation
   Flexible laminates are precision-cut to format. Thickness is verified to +5um and surface cleanliness confirmed before any subsequent processstep begins.
Polyimide
PET
LCP
Circuit Pattern Transfer
Circuit Pattern Transfer
   Photoimaging with UV-collimated exposure transfers the circuit pattern to the copper foil. Fine-line etching achieves minimum 0.075 mm trace/space.
Polyimide
PET
LCP
Material Preparation
Material Preparation
Laser or mechanical drilling creates micro-vias and through-holes without tearing the substrate. Hole size down to 0.1 mm with positional accuracy ±25 µm.
Polyimide
PET
LCP
Material Preparation
Material Preparation
Flexible polyimide coverlay film is laminated under controlled temperature and pressure, providing durable circuit protection that flexes repeatedly without cracking.
Polyimide
PET
LCP
PCB Manufacture

Related Products

ABOUT US

Frequently Asked Questions

PCB BLOG

Our Blog

ONLINE MESSAGE

Manufacturer of Highest Quality PCB

download
sd1
WhatsApp
sd2
Email