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Single Layer Flex
Most affordable option
Excellent tight bend radii
Ultra-lightweight
High-quality flexible and rigid-flex PCBs engineered for dynamic applications where space, weight and movement matter.
Most affordable option
Excellent tight bend radii
Ultra-lightweight
3D packaging capability
Fewer connectors & solder joints
Space and weight reduction
| Property | PIPolyimide | PETPolyester | PENPolyethylene Naphthalate | LCPLiquid Crystal Polymer |
|---|---|---|---|---|
| Temp Range | -65°C to 260°C | -40°C to 105°C | -50°C to 155°C | -200°C to 240°C |
| Dielectric Constant | 3.4 - 3.5 | 3.3 | 3.2 | 2.9 - 3.2 |
| Moisture Absorption | 2.5 - 3.0% | 0.4% | 0.3% | <0.04% |
| Tensile Strength | 180 MPa | 180 MPa | 220 MPa | 200 MPa |
| Flex Endurance | ||||
| RF Performance | ||||
| Cost Level | ||||
| Best For | Standard flex circuits, aerospace | Consumer electronics, disposables | Automotive, industrial | RF, microwave, 5G antenna |
Flexible laminates are precision-cut to format. Thickness is verified to ±5 µm and surface cleanliness confirmed before any subsequent process step begins.
Laser or mechanical drilling creates micro-vias and through-holes without tearing the substrate. Hole size down to 0.1 mm with positional accuracy ±25 µm.
Photoimaging with UV-collimated exposure transfers the circuit pattern to the copper foil. Fine-line etching achieves minimum 0.075 mm trace/space.
Flexible polyimide coverlay film is laminated under controlled temperature and pressure, providing durable circuit protection that flexes repeatedly without cracking.
Seamlessly integrating flexible and rigid substrates to eliminate connectors, reduce weight, and maximize space in high-performance electronics.
Superior thermal management with Alumina (Al2O3) and Aluminum Nitride (AlN) substrates for high-power, high-frequency, and aerospace applications.
Leading-edge rigid PCB manufacturing services from single-sided to complex 56-layer multilayer boards with industry-leading precision.
Expert reverse engineering services to convert physical PCB samples into complete CAD files, Schematics, and BOM lists with guaranteed 100% precision.
Material：Ceramic substrate；Layer：1L；
FinishBoardThickness：2.4mm;
MinLineWidth/Space：10/8mil；
MinHoleSize：0.6mm; SurfaceFinish：ENIG
Material: FR‑4; Layers: 4L;
Finished board thickness: 1.6mm;
Trace width / trace spacing: 6/5mil;
Minimum hole size: 0.2mm;
Surface finish: OSP
Material: FR‑4; Layers: 4L;
Finished board thickness: 2.0mm;
Trace width / trace spacing: 6/8mil;
Minimum hole size: 0.3mm;
Surface finish: Immersion Tin
Material：FR-4 ；Layer：4L；
FinishBoardThickness：1.2mm;
MinLineWidth/Space：4/3mil；
MinHoleSize：0.15mm; SurfaceFinish：ENIG
Material：FR-4 ；Layer：4L；
FinishBoardThickness：1.2mm;
MinLineWidth/Space：4/3mil；
MinHoleSize：0.15mm; SurfaceFinish：ENIG
The company has world-class production equipment (laser drilling machine, VCP through-hole filling line, blind hole AOI testing equipment, ceramic grinding line, vertical vacuum resin blocking machine, etc.), first-class technical team, mature product line, perfect service flow, to provide one-stop PCB services from design, sampling to mass production and assembly.
The products are widely used in communication (cell phones, computers, etc.), medical equipment (blood analyzers, hearing aids, etc.), industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.
All of our products are IPC rated with ISO 14001; ISO 9001; CE; ROHS certificates, etc. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.
We can deliver double-sided samples in 24 hours at the earliest, but we need to evaluate the delivery time according to the design file and the quantity.
TUOGEE always adheres to the service concept of customer first and quality first, and provides diversified customized services, which can produce single-sided boards, double-sided boards, multilayer boards and so on.
