Multilayer Rigid-Flex
Combining multiple rigid areas with several flexible layers. Ideal for complex medical devices and industrial controllers.
- Up to 20+ layers
- Air-gap construction
- Fine-pitch component support
Seamlessly integrating flexible and rigid substrates to eliminate connectors, reduce weight, and maximize space in high-performance electronics.

Combining multiple rigid areas with several flexible layers. Ideal for complex medical devices and industrial controllers.
Engineered for continuous bending applications like hinges or scanner heads with high cycle counts.
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Integrating Blind & Buried vias within hybrid constructions for the ultimate high-density interconnect requirements.
| Feature | Rigid PCB | Flexible PCB | Rigid-Flex |
|---|---|---|---|
| 3D Space Usage | Limited (Flat) | Excellent (Foldable) | Best (Self-Supporting) |
| Reliability (Vibration) | Medium | High | Excellent (No Connectors) |
| Component Support | Excellent | Moderate | Full (on Rigid sections) |
| Weight Reduction | Low | High | Optimal Hybrid |
High-quality flexible and rigid-flex PCBs engineered for dynamic applications where space, weight and movement matter.
Superior thermal management with Alumina (Al2O3) and Aluminum Nitride (AlN) substrates for high-power, high-frequency, and aerospace applications.
Leading-edge rigid PCB manufacturing services from single-sided to complex 56-layer multilayer boards with industry-leading precision.
Expert reverse engineering services to convert physical PCB samples into complete CAD files, Schematics, and BOM lists with guaranteed 100% precision.
Material:Ceramic substrate;Layer:1L;
FinishBoardThickness:2.4mm;
MinLineWidth/Space:10/8mil;
MinHoleSize:0.6mm; SurfaceFinish:ENIG
Material: FR‑4; Layers: 4L;
Finished board thickness: 1.6mm;
Trace width / trace spacing: 6/5mil;
Minimum hole size: 0.2mm;
Surface finish: OSP
Material: FR‑4; Layers: 4L;
Finished board thickness: 2.0mm;
Trace width / trace spacing: 6/8mil;
Minimum hole size: 0.3mm;
Surface finish: Immersion Tin
Material:FR-4 ;Layer:4L;
FinishBoardThickness:1.2mm;
MinLineWidth/Space:4/3mil;
MinHoleSize:0.15mm; SurfaceFinish:ENIG
Material:FR-4 ;Layer:4L;
FinishBoardThickness:1.2mm;
MinLineWidth/Space:4/3mil;
MinHoleSize:0.15mm; SurfaceFinish:ENIG
Rigid zone: usually 4-20 layers (up to 30 layers), flexible zone: 1-8 layers (multi-layer flexible structure), can also do 6-12 layers of rigid-flex combination (e.g., 6 layers rigid + 2 layers flexible) typical structure of the board, the actual number of layers need to be verified by DFM simulation, more than 16 layers of the design need to be additionally assessed for the loss of yield (every additional 5 layers, the yield decreased by 8-12%).
We can copy the board, but we can't evaluate the batch quantity, and we can't offer the price directly, because we don't know the model and brand of the devices on the PCB board, and we need to give the corresponding price according to the later production process, the brand and model of the assembled electronic components, and the production quantity.
All of our products are IPC rated with ISO 14001; ISO 9001; CE; ROHS certificates, etc. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.
Our pricing structure is transparent with no hidden fees. Our prices are among the most competitive in the world. In the case of PCBs, quotes can be made in as little as 10 minutes, based on the difficulty of the boards, the quoting time will be different.
Generally, we will ask the customer if he/she needs to quote the shipping price for his/her reference before quoting. If so, we will ask the courier company's price according to the address and zip code, and the weight of the product, and then quote the price.